WebMay 1, 2016 · First principles density functional theory calculations within the generalized gradient approximation are performed to comprehensively study the structural, elastic, electronic and thermodynamic properties of triclinic single and polycrystalline Cu 7 In 3.The polycrystalline elastic properties are predicted using the Voigt–Reuss–Hill approximation … WebJul 6, 2016 · SURFACE AND INTERFACE ANALYSIS Surf. Interface Anal. 2006; 38: 426–428 Published online in Wiley InterScience (www.interscience.wiley.com). DOI: 10.1002/sia.2193 Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process Ja-Myeong Koo, Jeong-Won Yoon and Seung-Boo Jung …
A comparison study of electromigration in In-48Sn solder …
WebInterfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows The Sn-58Bi solder paste with flux, which consisted of a dilute solution of zinc chloride and hydrochloric acid, wets the Cu matrix with a wetting angle of 35° [[18], [19], [20], [21] ]. Sn-Bi exhibits a negative volume change upon melting and is cheaper than the comparable In-Sn solders [ 22 ]. flore bande annonce
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WebApr 6, 2024 · HouseholdOffice 5 6 April 2024 Lead Environmental and Health Endangerment from CBEMS 280 at University of California, Irvine WebElectromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads WebA composite lead-free solder alloy composition having a nano-particles is provided and includes 40.0-60.0 wt% In, 0.01-2.0 wt% nano-particles and the remaining is Sn. The nano-particles is selected from TiO2, Al2O3, ZnO2, ZrO2, carbon nanotube or combination thereof, and the nano-particles has a particle diameter ranged from 5 nm to 500 nm. flore car boot